Taiwan Semiconductor Manufacturing Company TSM, also known as TSMC, is expanding beyond wafer fabrication by investing heavily in advanced packaging technology. This segment is becoming critical as AI ...

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies ...

Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

5.18.4. Packaging choices for packaging application processor environment (APE) in consumer electronics (1) 5.18.5. Packaging choices for packaging application processor environment (APE) in consumer ...

Amid rising domestic demand for semiconductors fueled by the rapid expansion of AI, China’s ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...

One of Singapore's first dedicated commercial-scale LED Chip-on-Board (CoB) packaging facilities — anchoring a vertically integrated global semiconductor and advanced electronics supply chain spanning ...

Yole Group released its latest technology and market report, Polymeric Materials for Advanced Packaging 2025, offering a deep dive into the role of polymers as critical enablers of next-generation ...

LED packaging maker Everlight Electronics said first-quarter 2026 earnings fell to NT$0.91 (US$0.03) per share from NT$1.32 a year earlier, reflecting a sharp increase in metal raw... LED packaging ...

Where does advanced packaging stand in 2017? Is it nearing an inflection point? The semiconductor industry is steadily running out of transistor scaling options, so the spotlight is inevitably turning ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...